International Journal of Extreme Manufacturing, Volume. 7, Issue 3, 35503(2025)
Three-dimensional direct lithography of stable quantum dots in hybrid glass
Semiconductor quantum dots (QDs), as high-performance materials, play an essential role in contemporary industry, mainly due to their high photoluminescent quantum yield, wide absorption characteristics, and size-dependent light emission. It is essential to construct well-defined micro-/nano-structures using QDs as building blocks for micro-optic applications. However, the fabrication of stable QDs with designed functional structures has long been challenging. Here, we propose a strategy for three-dimensional direct lithography of desired QDs within a hybrid medium with specific protection properties. The acrylate-functionalized hybrid precursors enable local crosslinking through ultrafast laser-induced multiphoton absorption, achieving sub-100 nm resolution surpassing the diffraction limit. The printed micro-/nano-structures possess thermal stability up to 600 °C, which can be transformed to inorganic architectures with a volume shrinkage. Due to the encapsulated QDs within the densely silicon-oxygen molecular networks, the functional structures demonstrate good stability against ultraviolet irradiation, corrosive solutions, and elevated temperatures. Based on hybrid 3D nanolithography, bicolor multilayer micro-/nano-structures are manufactured for applications in 3D data storage and optical information encryption. This research presents an effective strategy for the fabrication of desired QD micro-/nano-structures, supporting the development of stable functional device applications.
Get Citation
Copy Citation Text
Zhu Dezhi, Jiang Shangben, Wang Ying, Liu Dejun, Bao Weijia, Liu Liwei, Qu Junle, Wang Yiping, Liao Changrui. Three-dimensional direct lithography of stable quantum dots in hybrid glass[J]. International Journal of Extreme Manufacturing, 2025, 7(3): 35503
Category:
Received: Oct. 24, 2024
Accepted: Sep. 29, 2025
Published Online: Sep. 29, 2025
The Author Email: