APPLIED LASER, Volume. 39, Issue 3, 514(2019)
Three-dimensional Printing of Segmental Scoliosis Support based on Topology Optimization Technology
Aiming at the production of idiopathic scoliosis support which has a long processing cycle and needs modulus of mud in patients, and the machining process is very long. Some measures should be taken to solve these problems. The selective sintering 3D printing technology is applied to the manufacturing of idiopathic scoliosis support. After testing, the selective sintering technology can greatly shorten the processing time of the support, reduce the processing steps, and have certain advantages in testing the scaffolds morphology, and improve the efficiency of manufacturing of idiopathic scoliosis support. The patient is scanned mainly by means of a hand-held scanner, and a segmented scoliosis correction support is established based on the scan result. Combining Geomagic and Rhino software, simulation and topology optimization design through ANSYS Workbench, based on the topology optimization results of the model, the remove part is filled with honeycomb holes filling to reduce weight. The model is subjected to engineering stress verification, and the bearing capacity of the support before and after optimization is compared. The test results show that the innovatively proposed segmented scoliosis support can achieve lightweight function under the condition of setting certain constraints and ensuring the correcting function of the support. The topology optimization structure can achieve the weight reduction function, and the weight loss reaches 8.36%. After topological optimization, the load capacity of the front chest plate is 97.61% of the original structure, and the back plate is 96.62%.
Get Citation
Copy Citation Text
Chen Hetian, Chen Jimin, Yuan Yanping, Yan Hengfeng. Three-dimensional Printing of Segmental Scoliosis Support based on Topology Optimization Technology[J]. APPLIED LASER, 2019, 39(3): 514
Received: Oct. 31, 2018
Accepted: --
Published Online: Aug. 7, 2019
The Author Email: Hetian Chen (759516294@qq.com)