Chinese Journal of Liquid Crystals and Displays, Volume. 35, Issue 10, 991(2020)

High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging

YANG Yu-ming1,2、*, LI Yan1,2, ZHENG Huai-wen1, YU Fei1, YANG Hua1,2, YI Xiao-yan1,2, WANG Jun-xi1,2, and LI Jin-min1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    Ni/Au coating films plated on traditional direct plated copper (DPC) ceramic substrates will strongly absorb ultraviolet (UV) light. To enhance light extraction efficiency (LEE) of deep ultraviolet light emitting diodes (DUV LEDs), a DPC ceramic substrate plated with two metal coating films was designed and prepared. A Ni/Au film covering the pad of the DPC ceramic substrate can provide electrical interconnection for LEDs, and a high-reflection Al film partly covering the Ni/Au film can provide superior reflection for UV light. Optical, electrical and thermal properties of the DUV LED packaged by the Al-plated DPC ceramic substrate and traditional DPC ceramic substrate with only one Ni/Au coating film were measured, and models of the packaged LED were established and analyzed. As a result, by using the Al-plated DPC ceramic substrate, the light output power (LOP) of the DUV LED is enhanced by 19.2%, while the wall plug efficiency (WPE) and the external quantum efficiency (EQE) are enhanced by 1.20 and 1.19 times, respectively. Furthermore, after aging tests for 160 h, LEDs packaged by Al-plated DPC ceramic substrates showed better reliability. This Al-plated DPC ceramic substrate provides a feasible way to improve the LEE of DUV LEDs by packaging.

    Tools

    Get Citation

    Copy Citation Text

    YANG Yu-ming, LI Yan, ZHENG Huai-wen, YU Fei, YANG Hua, YI Xiao-yan, WANG Jun-xi, LI Jin-min. High-reflection Al-plated DPC ceramic substrate for AlGaN-based DUV LED packaging[J]. Chinese Journal of Liquid Crystals and Displays, 2020, 35(10): 991

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Mar. 31, 2020

    Accepted: --

    Published Online: Jan. 22, 2021

    The Author Email: YANG Yu-ming (ymyang@semi.ac.cn)

    DOI:10.37188/yjyxs20203510.0991

    Topics