Picosecond laser precision processing of diamond and other hard brittle materials are currently the hot spot in the technology frontier and the best engineering solution. The cutting surface edge breakage <5 μm and the roughness of the cutting surface roughness Ra1.6 can be achieved by conventional laser light source with pulse width ≤20 ps.Now the low-cost picosecond fiber laser with a pulse width of 200 ps was used. Laser power, cutting speed and other process parameters were optimized. Beam shaping was done through an external optical path shaping system. And focus lens optimization design and other key technologies for research and development. The maximum edge breakage width ≤6μm and the processing quality of the surface roughness Ra1.6 were achieved . The processing efficiency was consistent with 20 ps laser precision processing technology. The production cost was significantly reduced. The need of precision cutting of diamond tools was met. And the follow-up polishing problem of drawing die and cutting edge machining can be solved.