Carbon fiber composites are widely used in aircraft fuselage, wing, engine casing and other key structures because of their high specific strength, excellent fatigue resistance and lightweight characteristics. Compared with mechanical connection, adhesive connection will not cause damage to the connection material, can effectively avoid the problem of connection stress concentration, and show excellent fatigue resistance. The presence of resin on the surface of the carbon fiber composite material will affect the strength of the bonded joint. In order to ensure the excellent strength and durability of the bonded joint, it is necessary to remove the resin on the surface of the composite material as much as possible while avoiding damage to the carbon fiber substrate. Laser cleaning technology has outstanding advantages such as green, good cleaning effect, wide application range and non-contact, and has been applied in related fields.The laser cleaning test of the resin on the surface of carbon fiber composite materials (CFRP) was utilized by a pulsed fiber laser. The study examined the effects of laser energy density and travel speed on the cleaning outcomes. An analysis of the microstructure and elemental composition of the cleaned samples was conducted. Additionally, the contact angle post-cleaning were evaluated. A bonding experiment was performed, followed by tensile testing and tensile fatigue testing of the bonded parts. The fracture morphology was then assessed to verify the impact of laser cleaning on bonding properties.The results showed that with the increase of energy density, the removal effect of resin was improved initially, but excessive energy resulted in fiber damage. At a lower energy density (4.77 J/cm²), the resin began to fracture. At higher densities (above 6.37 J/cm²), fiber burn-out and breakage become apparent. Travel speed range from 6 mm/s to 2 mm/s. Higher travel speed reduce the interaction time, resulting in incomplete resin removal. Lower speed leads to better cleaning but risk damaging fibers due to heat accumulation. The analysis showed that effective cleaning corresponded to higher carbon content and lower oxygen content, indicating successful resin removal. As can be seen from Fig.8 (b), the surface bonding strength after S3 treatment can reach 13.02 MPa, which is higher than that of untreated and mechanically polished samples. According to the analysis of tensile fatigue performance, the number of load cycles of the joint after laser treatment is 144000, which is higher than the 95374 after mechanical polishing. At a laser energy density of 6.37 J/cm² and a laser travel speed of 4 mm/s, the resin is thoroughly cleaned and the carbon fiber matrix is completely exposed, which makes it more conducive to the penetration of the adhesive during the bonding process. At this time, the surface contact angle is lower than other laser treated and mechanically ground surfaces. Through analysis of tensile stress and cross-section, it is found that the laser cleaned sample has better adhesion performance with the metal.Laser energy density and laser travel speed both affect the removal of resin layer on the sample surface. With the increase of laser energy density, the removal amount of resin layer increases gradually. With the decrease of laser travel speed, the removal amount of resin layer increases gradually. Reasonable selection of laser energy density and travel speed can obtain the ideal cleaning effect. When the energy density is 6.37 J/cm² and the travel speed is 4 mm/s, the surface morphology is the cleanest, the surface contact angle is the smallest 63.29°. At a laser energy density of 6.37 J/cm² and a laser travel speed of 4mm/s, the interface failure mode is a mixed failure of carbon fiber adhesive layer aluminum alloy, with a shear strength of up to 13.02 MPa, which is more than twice that of untreated and it has good fatigue performance. Processing the surface of carbon fiber composite materials under appropriate laser process parameters can significantly improve the shear strength after bonding.