Chinese Journal of Lasers, Volume. 43, Issue 12, 1202003(2016)

Planning of Area-Partition Scanning Path and Its Effect on Residual Stress of SLM Molding Parts

Deng Shishi*, Yang Yongqiang, Li Yang, Wang Di, Wang Anmin, and Song Changhui
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  • [in Chinese]
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    In order to solve such problems as residual stress accumulated within layers being excessive, and warpage and cracks being easy to occur as a result of the long scanning line when selective laser melting is used to mold parts, one scheme of area-partition scanning is proposed. The S-shaped orthogonal layer cross scanning strategy and area-partition scanning strategy are respectively adopted to plan scanning path and the validity of the latter strategy is experimentally confirmed. The experimental results indicate that, with the area-partition scanning strategy, the tensile stress at rims of molding parts is effectively reduced, the fluctuation of residual stress at surface is weakened, and the mechanical property of molding parts is improved.

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    Deng Shishi, Yang Yongqiang, Li Yang, Wang Di, Wang Anmin, Song Changhui. Planning of Area-Partition Scanning Path and Its Effect on Residual Stress of SLM Molding Parts[J]. Chinese Journal of Lasers, 2016, 43(12): 1202003

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    Paper Information

    Category: laser manufacturing

    Received: Jul. 13, 2016

    Accepted: --

    Published Online: Dec. 9, 2016

    The Author Email: Shishi Deng (309261401@qq.com)

    DOI:10.3788/cjl201643.1202003

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