Micro-digital speckle correlation method (DSCM) is used to measure the mechanical property of advanced thin film material. From the high-quality displacement fields obtained by CCD camera, the mechanical property of the material can be achieved. In this application, the modulus of elasticity of the composite material of polyimide/SiO2 is obtained by use of DSCM. The out-plane displacement is achieved through the measurement of in-plane displacement, then the electrostrictive strain is evaluated by adding an electric field repeatly, and the electrostrictive coefficient of the sample can be obtained. In order to improve the accuracy of the measurement, the curved surface fitting algorithm is used to obtain the sub-pixel gray values. The results show that DSCM is an efficient and feasible method to analyze static and dynamic mechanical property of thin film material.