A short pulse(6 ns)laser with wavelength of 532 nm is employed to mill Y-TZP ceramic. The relationship between power and groove width by single-pass machining is explored, and the relationship between threshold and pulse number is analyzed to make sure the threshold of Y-TZP. Also the variation of removal rate and quality with different parameters is analyzed to determine the optimal process parameters further. the micron-sized twodimension structure is conducted further. The results show that the square of groove width is proportional to logarithmic peak pulse laser power, and the calculated laser spot radius is matched with measured value. The material threshold decreases with the increase in the number of pulses. The removal rate is up to the maximum, 1.35 mm3/min, in the optimum combination of scanning speed, power and repetition rate. The blind hole of diameter 500 mm and steps in square cavity structure of width 200 mm and depth 100 mm are obtained by optimizing laser processing parameters. The two-dimension structures are no crack and better processing quality and the surface roughness Ra is 3.746 mm.