The OLED screen COF (Chip on Film) connection transition zone is prone to the problem of metal layer fracture in the bending and reliability stages. In this paper, the COF bending traveled of flexible screen is showed. And the finite element method is used to analyze the influence of those factor, such as the offset of related structure in the transition zone of COF connection, the thickness of the adhesive layer on the stress of the metal layer under the bending process and the reliability factors. Meanwhile,the change of metal layer stress is researched after bending path altered. The results show that the maximum stress amplitude of metal layer in bending process increases obviously with U-film shifting to the left and right, bending path moving up and down, and also increases gradually with Foam shifting from left to right and the thickness of the metal cover layer (MCL) glue increasing. In the reliability results, the maximum stress on the metal layer is decreased then stable with the deviation of U-film and Foam from left to right, and is increased and then decreased with the increase of the MCL thickness added. The analysis results provide a reference for the design of the stacking structure and the control of its attached deviation interval in the bending zone. Meantime, it provide a theoretical basis for the design of the bending path and troubleshooting analysis.