To meet the urgent demand for high-speed interconnects in data centers driven by the explosive growth of artificial intelligence（AI）computing power, an 800 Gb/s 2×FR4 silicon photonic module technical solution is proposed. This paper introduces the constituent units of the optical module, which employs an integrated multiplexer（MUX）silicon photonic modulator chip, a silicon nitride waveguide cascaded Mach-Zehnder interferometer（MZI）multiplexing structure, and traveling-wave electrode design to achieve efficient modulation and multiplexing of 8×100 Gb/s 4-level pulse amplitude modulation（PAM4）signals. Test results demonstrate that the silicon photonic chip exhibits a 3 dB bandwidth exceeding 30 GHz and an insertion loss ranging from-9 to-12 dB, with all module performance metrics meeting protocol specifications and demonstrating excellent performance.