Bulletin of the Chinese Ceramic Society, Volume. 44, Issue 6, 2046(2025)

Reactive Molecular Dynamics Study on Thermal Stability of Type I Defect C-S-H Gel Phase

SUN Ming1, TANG Qingyin2, GUO Haoran2, WANG Pan2、*, and YUAN Xiongzhou1
Author Affiliations
  • 1Department of Transportation and Environment, Shenzhen Institute of Information Technology, Shenzhen 518172, China
  • 2Department of Civil Engineering, Qingdao University of Technology, Qingdao 266520, China
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    Under high temperature conditions, the presence of defects and confined water in C-S-H gel significantly affects its strength and durability. This study employed reactive molecular dynamics to investigate the molecular structural characteristics and reactivity of type I defect C-S-H gel under high temperature environments. The findings reveal that the increase in temperature and Ca/Si ratio enhances the mobility of water molecules, accelerating their penetration into the layered structure, reducing structural order and connectivity, leading to an increase in Q1 and Q0, and weakening the thermal stability of C-S-H gel. Type I defect causes the C-S-H gel to expand along the interlayer direction, and the expansion rate increases with rising temperature and Ca/Si ratio. Under high temperature and high Ca/Si ratio conditions, the reactivity of water molecules is enhanced, promoting hydrolysis reactions and the formation of hydroxyl groups, and type I defect rapidly expands, significantly affecting the structural stability of gel. The results of this study provide theoretical support for improving the performance of concrete in extreme environments such as fires.

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    SUN Ming, TANG Qingyin, GUO Haoran, WANG Pan, YUAN Xiongzhou. Reactive Molecular Dynamics Study on Thermal Stability of Type I Defect C-S-H Gel Phase[J]. Bulletin of the Chinese Ceramic Society, 2025, 44(6): 2046

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    Paper Information

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    Received: Oct. 30, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email: WANG Pan (wangpan@qut.edu.cn)

    DOI:10.16552/j.cnki.issn1001-1625.2024.1301

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