Acta Optica Sinica, Volume. 28, Issue 2, 349(2008)

A Soft-Lithography-Based Vertically Coupling Structure for Multilayered Optical Interconnection

Liu Yanting*, Ni Wei, and Wu Xingkun
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  • [in Chinese]
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    A novel vertical coupling structure is designed for multilayered optical interconnection, regarding as one of most promising approaches for high-speed communications in next-generation computer. The layer-to-layer coupling features a simple S-shaped structure with an insertion loss as low as 0.05 dB. For four cross sections of 30 μm×30 μm, 50 μm×50 μm,100 μm×100 μm, and 200 μm×200 μm calculations for cross-over of up to 6 layers were performed using Monte Carlo ray tracing simulation, it was found that a low-loss coupling (less than 1 dB) can be achieved as the ratio of cross-over height to traveling distance is about 0.128. Experimental prototypes were fabricated by using soft-lithography and measurement agrees with the calculated result in general.

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    Liu Yanting, Ni Wei, Wu Xingkun. A Soft-Lithography-Based Vertically Coupling Structure for Multilayered Optical Interconnection[J]. Acta Optica Sinica, 2008, 28(2): 349

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    Paper Information

    Category: Optical Devices

    Received: May. 28, 2007

    Accepted: --

    Published Online: Mar. 24, 2008

    The Author Email: Yanting Liu (rikfeng@163.com)

    DOI:

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