Semiconductor Optoelectronics, Volume. 46, Issue 4, 630(2025)

Study on the Fabrication and Heat Sink Performance of Cu-Cr-Zr Micro-Channel Heat Sinking SLM for Laser Chips

CAI Yixun1, YANG Guangzhao1, ZHONG Xin1, PAN Linlin1, CAO Mingxuan1, FU Bin1, YUAN Minghui2, and LI Huijun1
Author Affiliations
  • 1School of Mechanical and Automation Engineering, Wuyi University, Jiangmen 529020, CHN
  • 2Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Hong Kong 999077, CHN
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    A micro-channel heat sink (MCHS) made of chromium-zirconium-copper (Cu-Cr-Zr) was fabricated using selective laser melting (SLM) technology. The minimum achievable dimensions of the MCHS flow channels were optimized and tested. When the designed height and width were set to 1.7 mm, the actual formed dimensions measure approximately 1.078 mm in height and 1.415 mm in width. Further experiments have shown that reducing the designed channel height below 1.7 mm significantly increases the likelihood of flow channel blockage. Following the soldering of a semiconductor laser chip onto the heat sink surface, its output characteristics were evaluated. The laser chip exhibited a threshold current of 1.02 A. At a driving current of 5.39 A, the output power reached 4.601 W with a slope efficiency of 0.85 W/A. Additionally, the thermal resistance of the MCHS made of Cu-Cr-Zr has been measured as 7.33 °C/W. A 50 h stability test showed that the output power of the laser chip decreased by 8.54% before stabilizing. The experimental results confirm the feasibility of using SLM technology for MCHS fabrication and its potential for industrial-scale production.

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    CAI Yixun, YANG Guangzhao, ZHONG Xin, PAN Linlin, CAO Mingxuan, FU Bin, YUAN Minghui, LI Huijun. Study on the Fabrication and Heat Sink Performance of Cu-Cr-Zr Micro-Channel Heat Sinking SLM for Laser Chips[J]. Semiconductor Optoelectronics, 2025, 46(4): 630

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    Paper Information

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    Received: Feb. 24, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250224001

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