Laser Technology, Volume. 46, Issue 6, 736(2022)

Hole shape characteristics in femtosecond laser drilling of SiC/SiC composite thick plate

LIU Zhuang1, FANG Ju1, LI Yuancheng2, and ZHANG Xiaobing2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    In order to evaluate the hole shape characteristics in femtosecond laser drilling of SiC/SiC composite, an experimental study has been conducted on 4mm thick specimen using beam concentric scanning mode. The effect of process parameters on entry diameter, hole depth, and hole taper has been analyzed. The results show that pulse energy, pulse frequency, line overlap ratio, and scanning speed have almost no influence on entry diameter. However, these factors significantly affect hole depth and hole taper. The pulse energy, pulse frequency, line overlap ratio, and scanning speed markedly influence energy density per unit area that during scanning of the laser beam. Higher energy density results in lower hole taper and greater hole depth. The experiment reached a minimum taper angle of 12.38° using the maximum pulse energy 130μJ, maximum repetition frequency 100kHz, minimum scanning speed 100mm/s, maximum line overlap 77% and minimum feed distance 0.1mm. It is concluded that the taper angle can hardly be controlled because the upper material will shelter part of the laser beam and there is difficulty to evacuate chips. This study can provide a reference for the future application of ultra-short pulse laser drilling of SiC/SiC composites.

    Tools

    Get Citation

    Copy Citation Text

    LIU Zhuang, FANG Ju, LI Yuancheng, ZHANG Xiaobing. Hole shape characteristics in femtosecond laser drilling of SiC/SiC composite thick plate[J]. Laser Technology, 2022, 46(6): 736

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Nov. 16, 2021

    Accepted: --

    Published Online: Feb. 4, 2023

    The Author Email:

    DOI:10-7510/jgjs-issn-1001-3806-2022-06-004

    Topics