Acta Optica Sinica, Volume. 45, Issue 17, 1720025(2025)
Dual-Function Visible Light Communication Chip Based on μ-LED Circular Array
This study focuses on developing a dual-functional visible light communication (VLC) chip utilizing micro-LED (μ-LED) suspended membrane circular arrays to address the performance limitations of conventional LEDs in high-speed optical communication. Through the design and fabrication of μ-LED arrays in different dimensions (20, 30, and 40 μm), the research examines the dimensional effects on light emission and detection performance, maximizing modulation bandwidth and optoelectronic conversion efficiency. The implementation of a suspended membrane structure and multiple-input multiple-output (MIMO) technology enhances data transmission rates and communication capacity while integrating emission and detection capabilities, establishing foundational support for dual-functional VLC systems. This study advances duplex VLC technology, particularly in optoelectronic performance and transmission rates, highlighting the significant potential of μ-LED arrays in high-speed optical communication and detection applications.
The chip fabrication utilized a 2-inch (5.08 cm) Si substrate GaN epitaxial wafer, with GaN epitaxial layers grown via metal-organic chemical vapor deposition (MOCVD) technology. The epitaxial layer measures approximately 4.575 μm in total thickness, comprising a 0.7 μm AlN/AlGaN buffer layer, a 0.8 μm undoped GaN (u-GaN) layer, a 2.8 μm n-GaN layer, a 100 nm (In)GaN layer, a 50 nm multi-quantum well (MQWs) active layer, and a 125 nm p-GaN layer. The Si substrate was thinned to 200 μm to facilitate removal. The fabrication process encompassed several critical steps: 1) Deposition of a 20 nm/100 nm Ni/Au metal layer on the p-GaN layer for p-type ohmic contact electrode formation. 2) Implementation of photolithography, ion beam etching (IBE), and inductively coupled plasma (ICP) etching to create circular μ-LED arrays in three dimensions (diameters: 20, 30, and 40 μm), exposing the n-GaN layer during ICP etching. 3) Deposition of a 50 nm/100 nm/100 nm Ti/Pt/Au metal layer on the exposed n-GaN layer to form the n-type ohmic contact electrode. 4) Application of a 200 nm SiO2 insulating layer via plasma-enhanced chemical vapor deposition (PECVD), followed by photolithography and reactive ion etching (RIE) to establish pad openings for electrode connection. 5) Post-pad layer deposition and photoresist removal, application of new photoresist for surface protection, followed by photolithography for Si substrate etching window creation. Deep silicon etching technology facilitated Si substrate removal, establishing the suspended membrane μ-LED chip. 6) Following surface cleaning, the chip was mounted on a printed circuit board (PCB) and equipped with an SMA interface for subsequent analysis. The fabrication process yielded a dual-functional VLC chip demonstrating notable advantages in both emission and detection capabilities. Smaller arrays exhibited superior high-speed data transmission, while medium-sized arrays demonstrated optimal signal quality as photodetectors, featuring minimal jitter and waveform distortion for enhanced sensitivity and detection precision. This research provides comprehensive theoretical and experimental validation for dual-functional VLC system development.
Sample A1 demonstrates enhanced capacitance characteristics, with higher peaks and lower valleys, indicating accelerated capacitance reduction and superior carrier recombination efficiency and response speed compared to other samples. This enhanced response capability is essential for high-speed optical communication, enabling elevated modulation frequencies and improved data transmission rates [Fig. 4(c)]. The reduced LED dimensions contribute to lower parasitic capacitance, decreasing the RC time constant (
This study presents the design, fabrication, and evaluation of a suspended circular blue μ-LED array. Through the implementation of backside processing technology to fully remove the Si substrate, the optoelectronic performance of GaN-based μ-LEDs demonstrated substantial enhancement. The research team fabricated μ-LED chips with three different dimensions (
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Zheng Shi, Tianlong Xie, Mingyuan Xie, Ting Yu, Zhenxing Li, Yan Jiang, Yongjin Wang, Haitao Zhao, Xumin Gao. Dual-Function Visible Light Communication Chip Based on μ-LED Circular Array[J]. Acta Optica Sinica, 2025, 45(17): 1720025
Category: Optics in Computing
Received: Dec. 26, 2024
Accepted: Mar. 19, 2025
Published Online: Sep. 3, 2025
The Author Email: Xumin Gao (gaoxm@njupt.edu.cn)
CSTR:32393.14.AOS241946