To improve the production capacity, the PI (polyimide) film coating method of High Advanced Dimension Switch (HADS) products is changed from APR transfer printing ( Roller Coater) to inkjet printing(Inkjet Printer). The change of coating method causes the accumulation of polyimide (PI) solution near the Vcom via hole and Vcom line which exists in the peripheral zone, which causes a failure named “peripheral black line”. Firstly, we can solve the diffusion problem of PI solution by changing PVX (passivation SiNx) mask, that is, to reduce the influence of via hole by changing the cycle, size and distance between via hole and active area. we reduce the cycle of Vcom via hole near gate pad (GP) area by a factor of eight, the occupied area of Vcom via hole decreases by 98% than before. In the meanwhile, we reduce the cycle of Vcom via hole near date pad (DP) area by a factor of nine, the occupied area of Vcom via hole decreases by 99%, the distance between via hole of GP area and AA area increases by 60% than before. The changing of PVX mask greatly improves the diffusion of PI solution, eventually, the failure rate of black line reduces from 100% to 6.6%. Secondly, we develop an edge compensation function of inkjet printer to reduce the accumulation of PI solution in peripheral area, that is, the PI thickness of peripheral area is half the active area, the reduction of PI solution in the EM area reduces the possibility of accumulation in the area, and then the failure rate of black line reduces from 6.6% to 0.5%. Thirdly, we change the coating mode from pattern coating to strip-type coating, that is, the GP area is filled with PI solution in all area, which reduces the failure rate from 0.5% to 0.05%. By changing the PVX mask design and process parameters of Inkjet printer, the incidence of peripheral black line defects are reduced from 100% to 0.05%, meeting the mass production needs.