To meet the requirements of high power laser diode-pumped solid-state lasers, packaging of 808 nm 1500 W continuous wave (CW) operation perpendicularity laser diode stack is reported. Theoretically, the influences of packaging-induced stress, thermal resistance, and beam collimation on high power laser diode stack fabrication are explained detailedly. The origination, exhibition and reduction approach of the residual stress are illuminated. Simulation of temperature distribution of the micro-channel heat sink is depicted. Necessity of the beam collimation and the relation between soldering process and focusing optics system are illustrated. The residual stress is reduced by investigating and using indium-gold composite solder and optimizing the parameters of the soldering process, and the alignment precision is improved by designing collimation tools that a average value of 2 μm for the smile and 6 mrad for the divergence angle could be realized.