Chinese Journal of Lasers, Volume. 38, Issue 6, 603002(2011)

Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics

Ji Lingfei*, Yan Yinzhou, Bao Yong, Chen Xiaochuan, and Jiang Yijian
Author Affiliations
  • [in Chinese]
  • show less

    Achievement of laser close-piercing lapping processing technique for damage-free cutting in arbitrary path (line, curve and angle) of dense Al2O3 ceramics with the thickness of 10~12 mm by CO2 laser is proposed. By the combination analysis of scan electron microscope (SEM) and laser scanning confocal microscope on the cut surface, the good cut quality is concluded. Based on the CCD analysis of the novel cutting processing, the optimal process parameters for damage-free cutting of 10 mm thick Al2O3 ceramics including peak power of 2.7~3.5 kW, pulse frequency of about 50 Hz, cycle duty of 30%~50% and piercing time of 0.1~0.5 s, are obtained. The optimal line cutting speed can be 15~20 mm/min.

    Tools

    Get Citation

    Copy Citation Text

    Ji Lingfei, Yan Yinzhou, Bao Yong, Chen Xiaochuan, Jiang Yijian. Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics[J]. Chinese Journal of Lasers, 2011, 38(6): 603002

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: laser manufacturing

    Received: Apr. 2, 2011

    Accepted: --

    Published Online: May. 26, 2011

    The Author Email: Lingfei Ji (ncltji@bjut.edu.cn)

    DOI:10.3788/cjl201138.0603002

    Topics