Chinese Journal of Lasers, Volume. 38, Issue 6, 603002(2011)
Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics
Achievement of laser close-piercing lapping processing technique for damage-free cutting in arbitrary path (line, curve and angle) of dense Al2O3 ceramics with the thickness of 10~12 mm by CO2 laser is proposed. By the combination analysis of scan electron microscope (SEM) and laser scanning confocal microscope on the cut surface, the good cut quality is concluded. Based on the CCD analysis of the novel cutting processing, the optimal process parameters for damage-free cutting of 10 mm thick Al2O3 ceramics including peak power of 2.7~3.5 kW, pulse frequency of about 50 Hz, cycle duty of 30%~50% and piercing time of 0.1~0.5 s, are obtained. The optimal line cutting speed can be 15~20 mm/min.
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Ji Lingfei, Yan Yinzhou, Bao Yong, Chen Xiaochuan, Jiang Yijian. Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics[J]. Chinese Journal of Lasers, 2011, 38(6): 603002
Category: laser manufacturing
Received: Apr. 2, 2011
Accepted: --
Published Online: May. 26, 2011
The Author Email: Lingfei Ji (ncltji@bjut.edu.cn)