After the sensor photo process is completed for SLOC products, macro observation shows that there is a large area of Mura on the color filter chamfered side of the substrate. The critical dimension (CD) value of the Mura area and the normal area is tested. The CD value of the Mura area is significantly larger, and some points exceed spec. In addition, the average incidence of Short in the module section of the SLOC product in the production process is 2.82%, and the location of the Short is basically consistent with the larger areas of Mura and CD, and has a strong correlation. Through tests such as spin coating and actual tape-out observation, the device that caused Mura to be locked is the developer. As the substrate from the DEV#1 to the DEV#2 is dried at the end of the substrate, the liquid solution is dried, which leads to poor development, which in turn causes Mura. This article refers to this as dry Mura. In order to solve this problem, the speed of substrate transferd from DEV#1 to DEV#2 is modified by software. The drying Mura is slightly improved but not eliminated. Later, by adding a secondary aqua knife method in the DEV#1 chamber, the dry Mura of SLOC sensor photo is eliminated. The CD uniformity of SLOC products increases from 3.3% to 1.9%, and the short defect rate decreases from an average of 2.82% before improvement to an average of 0.27%.