This study seeks to improve the thermal management technology of electronic devices through constructal optimization design.

First, the 3D flow and heat transfer numerical model of a hybrid microchannel heat sink is established, and the volume ratio and relative position of its single-sided internal fins are fixed. Constructal optimization is then performed, for which the height-to-width ratio h/w and spacing distribution of fins ε are taken as the design variables, and the minimization of the temperature gradient uniformity factor in the solid region of the heat sink is taken as the objective. The exhaustive method and genetic algorithm are subsequently performed.

The results show that both the exhaustive method and genetic algorithm can find the minimum value of the temperature gradient uniformity factor and corresponding optimal construct, and the temperature gradient uniformity is improved by up to 13.30% compared to that of the finless microchannel heat sink. The relative difference in the obtained minimum objective function value between the exhaustive method and ten genetic algorithm schemes is no more than 0.92%.

This study provides new optimization design results for the research and development of heat sinks for electronic devices.