Chinese Journal of Lasers, Volume. 34, Issue 6, 861(2007)
Laser Pre-Stressed Compound Peen Forming of Plate
Based on the analysis of advantages on laser thermal-stress forming (LTF) and laser peen forming (LPF), a laser pre-stressed compound peen forming of plate is presented, the technology combines heat stack action of continuous laser and shock wave action of pulse laser, so it combines heating effect and mechanics effect. At first, CO2 laser is used to scan SUS304 stainless plate which is 2 mm thickness according to special tracks to apply pre-load stress, the basic configuration is formed and residual stress is measured. ATOS-Ⅱ optical scan measure system is used to measure the contours of the plate′s surface after pre-forming, the reverse engineering software Imageware is used to establish virtual model of the plate. Then the interface between ABAQUS and Imageware is used to invert virtual model into finite element model, the optimum distribution of residual stress field is obtained through adjusting laser processing parameters and controlling tracks of laser peening by ABAQUS. Finally, the optimum laser parameters and processing condition are used for laser peen forming experiment. The results indicate that the anticipated shape is obtained, and both sides of the plate hold residual compressive stress field after laser pre-stressed compound peen forming.
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[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Laser Pre-Stressed Compound Peen Forming of Plate[J]. Chinese Journal of Lasers, 2007, 34(6): 861