The thickness of adhesive significantly impacts the bending resistance and functionality of SIM cards. Traditional measurement methods, such as using a micrometer, are inefficient and can damage the adhesive surface. To enhance the accuracy and efficiency of adhesive thickness measurement, this paper introduces a high-precision method based on laser point cloud technology. Firstly, a line laser profile sensor is used to obtain the depth map of the glue, and missing pixels in the image are repaired. Then, NCC template matching is employed to locate and segment each glue spot, and point cloud reconstruction is performed. Next, statistical filtering is applied to eliminate outliers. Finally, an improved RANSAC algorithm is utilized to fit the best plane equation parameters, and the height information of the top and bottom surfaces of the glue is calculated as the glue thickness. The glue thickness obtained by this method is compared with the measurements from the micrometer, and repeat tests are conducted. The results show that for 10 groups of different glues, the maximum average error is less than ±6 μm, and the repeatability is less than 0.3%. The test results validate that this method has good accuracy and stability, meeting the requirements of industrial measurement.