With the development of linear infrared detector technology, the demand for ultra large field of view scanning is an important direction for application of linear infrared detectors. Ultra large field of view scanning is usually accomplished by splicing of multiple linear infrared detectors, and the core of the splicing design is mainly the packaging structure design. How to fully lead the detector signal completely out of the packaging body is what needs to be done in the electrical design of packaging structure design. The article introduces the packaging electrical design of a splicing structure of a linear infrared detector. Firstly, the splicing method of the splicing structure is described, including the splicing method of the spliced structure, as well as the electrical structural design scheme to meet the structure, especially for the secondary processing part of the signal. Finally, the electrical wiring design solution for the electrical structure scheme is presented.