Microelectronics, Volume. 52, Issue 3, 513(2022)
Study on Wire Tail Controlling in Heavy Aluminium Wire Bonding
Wire tail defects exposed in ultrasonic wedge bonding on automatic heavy wire bonder were examined, and the generating mechanism of wire tail was analyzed. A wire tail fault tree was set up, a tail defects’ fishbone diagrams was built, and a relationship matrix between the phenomenon of tail wire defect and its root cause factors was proposed. The key factors and requirements of tail quality controlling were established.
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HE Congyong, LI Shuangjiang. Study on Wire Tail Controlling in Heavy Aluminium Wire Bonding[J]. Microelectronics, 2022, 52(3): 513
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Received: Oct. 31, 2021
Accepted: --
Published Online: Jan. 18, 2023
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