Microelectronics, Volume. 52, Issue 3, 513(2022)

Study on Wire Tail Controlling in Heavy Aluminium Wire Bonding

HE Congyong and LI Shuangjiang
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  • [in Chinese]
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    Wire tail defects exposed in ultrasonic wedge bonding on automatic heavy wire bonder were examined, and the generating mechanism of wire tail was analyzed. A wire tail fault tree was set up, a tail defects’ fishbone diagrams was built, and a relationship matrix between the phenomenon of tail wire defect and its root cause factors was proposed. The key factors and requirements of tail quality controlling were established.

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    HE Congyong, LI Shuangjiang. Study on Wire Tail Controlling in Heavy Aluminium Wire Bonding[J]. Microelectronics, 2022, 52(3): 513

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    Paper Information

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    Received: Oct. 31, 2021

    Accepted: --

    Published Online: Jan. 18, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.210416

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