In order to solve the problem that the solidification stress of the micro thick adhesive layer used for optical component bonding cannot be determined under constant temperature, a dynamic monitoring system for the curing state of the micro thick adhesive layer is designed. Firstly, the monitoring principle of the micro thick adhesive layer is established through the analysis of the generation mechanism and influencing factors of the constant temperature solidification stress in the micro thick adhesive layer, and the scheme of the monitoring system of the curing state of the adhesive layer is formulated. Then the key components of each functional module are designed in detail. The stiffness, deflection and deformation of the supporting structure are calculated in details and analyzed by finite element method, and the assembly model of the whole machine is established based on the assembly pattern. Finally, the performance of the system designed to detect curing state is verified by experiments. The results show that the optimized monitoring system is reasonably designed, and the overall stiffness of the U-shaped structure with 45° support angle is 84% higher than that of the initially selected 7-shaped structure. Using this system for practical application, the characteristic curing tensile stress value in the curing stage of the adhesive layer is monitored and obtained, and the application effect is good. This study provides a theoretical reference for the curing principle of micro thick adhesive layer, and makes it possible to monitor the curing state of micro thick adhesive layer under constant temperature.