Microelectronics, Volume. 55, Issue 4, 684(2025)

Thermal Design of Magnetic Devices for High Power Hybrid Integrated DC/DC Converters

XIANG Min, WANG Zhixuan, and LIAN Dong
Author Affiliations
  • The 24th Institute of China Electronics Technology Group Corporation, Chongqing 401332, P R China
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    With the continuous enhancement of DC/DC converter power, there has been a notable increase in heat generation, highlighting the growing significance of thermal design in ensuring product reliability. This paper addresses the issue of elevated temperatures in magnetic components within high-power hybrid integrated DC/DC converters by analyzing their heating mechanisms and heat dissipation pathways. Utilizing the finite element simulation software ANSYS Icepak, various heat dissipation schemes were modeled and analyzed. A comprehensive optimization strategy was proposed, involving filling the magnetic device with high thermal conductivity potting compound to minimize the thermal resistance between the copper winding and the magnetic core, as well as adding adhesive between the sidewalls of the magnetic core and the shell to augment the heat dissipation area. Both simulation results and physical testing have confirmed that the optimized magnetic device experiences a temperature reduction of 15.5 ℃, and the process adaptability has been validated through reliability testing.

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    XIANG Min, WANG Zhixuan, LIAN Dong. Thermal Design of Magnetic Devices for High Power Hybrid Integrated DC/DC Converters[J]. Microelectronics, 2025, 55(4): 684

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    Paper Information

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    Received: Nov. 9, 2024

    Accepted: Sep. 9, 2025

    Published Online: Sep. 9, 2025

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.240405

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