This paper investigates laser bonding of silicon and Pyrex7740 glass by finite element method (FEM) simulation, self-design of apparatus and experimental research, test and characterization of bonding results. Based on a theoretical heat transfer two-dimensional (2D) model, a three-dimensional (3D) numerical simulation of laser bonding silicon and glass with laser power 20~48 W is conducted using ANSYS FEM softwave. Simulation results include temperature field and melted bonding depth which predicts the bonding threshold power is 28 W. A laser bonding apparatus with laser spot diameter of 150 μm and laser power of 30 W is designed to achieve good bonding. Shear force test shows that the bonding strength is 5.2 times of that of anodic bonding, while helium leak test on hermeticity of bonding samples observes average leakage rate of about 9.29×10-9 Pa·m3/s, which is the same order of magnitude as anodic bonding. From energy dispersive spectroscopy (EDS) line scanning laser bonded Si/glass interface cross section, the thickness of transition layer is 9 μm under 30 W laser, which agrees with the simulation results.