Laser Technology, Volume. 47, Issue 1, 1(2023)

Global technical cooperation from the perspective of extreme ultraviolet lithography development

ZENG Haifeng1,2,3, GUO Lei1,2,3, LI Shiguang1,2,3, ZHONG Zhijian1,2, LI Chenyi1,2, YU Jiang4, and LI Xianjie3
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
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    Extreme ultraviolet (EUV) lithography is the most important part of the “neck” technology for chips. EUV lithography technology has been widely used in the manufacturing of integrated circuit chips with the most advanced process nodes. Its research and development cross integrates the knowledge of optics, machinery, electronics, control, software, materials, mathematics, physics and other disciplines. The development of EUV lithography reflects the evolution of joint research and development worldwide, and openness and cooperation are the main themes in the development process. The development history of EUV lithography and the major projects and institutions involved were reviewed. The flexible international cooperation route of ASML, the world’s only EUV lithography manufacturer, was discussed. The research and development trends of representative research and development institutions in the world since 1997 and the relationship with the development of EUV lithography were analyzed. The influence of worldwide cooperation among participating institutions on the development of EUV lithography was described in detail. This research provides some enlightenment and reference for the research and development of advanced lithography machines and other similar high-end equipment.

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    ZENG Haifeng, GUO Lei, LI Shiguang, ZHONG Zhijian, LI Chenyi, YU Jiang, LI Xianjie. Global technical cooperation from the perspective of extreme ultraviolet lithography development[J]. Laser Technology, 2023, 47(1): 1

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    Paper Information

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    Received: Jan. 13, 2022

    Accepted: --

    Published Online: Apr. 12, 2023

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    DOI:10.7510/jgjs.issn.1001-3806.2023.01.001

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