To address the problems of edge collapse and crashing in the chamfering process of non-standard crystal bulk and wafers, the side by side modular fixtures and vacuum adsorption disk components are designed to fix the product, and the 45° and arc cutters are designed, and then the single straight line and positive offset path are used for processing. The experimental results show that compared with the traditional chamfering process, the optimized process can greatly reduce the edge collapse and crashing during the chamfering process, and the unqualified rate is reduced from 14.78% to 3.09%, which is beneficial for batch production.