As communication devices continue to advance toward greater portability and slimmer designs, the demand for smaller, high-performance surface acoustic wave (SAW) chips has consistently increased. To ensure product quality, implementing effective quality control and reliability testing throughout the chip development and manufacturing processes is essential. An analysis of the failure modes and effects of SAW chips identifies potential risks during both the design and production stages. Based on these findings, appropriate quality control measures were established, and reliability testing methods were developed to improve the chip yield. The effectiveness of these quality control and reliability testing methods has been validated, offering valuable insights for the industry.