Chinese Journal of Lasers, Volume. 35, Issue 4, 625(2008)

Residual Stress Analysis of the Remelting Zone on 42CrMo Steel Plate in Single-Pass Laser Wide-Band Treatment

Zhan Huanxiao1,2、*, Wang Yong1, Han Tao1, and Han Bin1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    Based on SYSWELD finite element code, a three-dimensional finite element model for laser remelting process was created, the wide-band heat source model implemented by a FORTRAN subroutine was developed to simulate the single-pass laser wide band remelting process on 42CrMo steel, and predict residual stresses of the remelting zones with different technological parameters were estimated and analyzed. The thermal cycle was measured by temperature measuring equipment and phase transformation was observed by scanning electron microscopy (SEM). The results showed that technological parameters has a great influence on the residual stress distribution of the remelting zone, the superficial processability of the laser remelting zone is bad whether the laser energy input density is too high or too low. The favorable residual compressive stress in the remelting zone can be achieved when the laser output power is 3500 W, the scanning rate is ranged from 600 mm/min to 1000 mm/min, that is, the energy input density is within 20.9~35.0 J/mm2. After the processing, the initial ferrite-pearlite microstructure of the matrix is transformed to martensite phase with the proportion higher than 95%.

    Tools

    Get Citation

    Copy Citation Text

    Zhan Huanxiao, Wang Yong, Han Tao, Han Bin. Residual Stress Analysis of the Remelting Zone on 42CrMo Steel Plate in Single-Pass Laser Wide-Band Treatment[J]. Chinese Journal of Lasers, 2008, 35(4): 625

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: laser manufacturing

    Received: Aug. 12, 2007

    Accepted: --

    Published Online: Apr. 21, 2008

    The Author Email: Huanxiao Zhan (J_ever@163.com)

    DOI:

    Topics