Journal of Advanced Dielectrics, Volume. 12, Issue 3, 2250004(2022)

Study on properties of ultra-low dielectric loss mPPO/MTCLT composites prepared by injection molding

Yahan Liu1、*, Haiyi Peng2, Xiaogang Yao2, Minmin Mao1, Kaixin Song1, and Huixing Lin2
Author Affiliations
  • 1College of Electronic Information and Engineering, Hangzhou Dianzi University, 1158 Baiyang Street 2nd Street, Hangzhou 310018, P. R. China
  • 2Key Laboratory of Inorganic Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 588 Heshuo Road, Shanghai 201800, P. R. China
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    A novel category of polyphenylene oxide/high-impact polystyrene (PPO/HIPS) alloy was used as the polymer matrix (abbreviated as mPPO) and loaded with different volume fractions (0, 10, 20, 30, 40, 50 vol.%) of MgTiO3–Ca0.7La0.2TiO3 (abbreviated as MTCLT) ceramics to prepare composites by injection molding. Its micromorphology, density, dielectric, thermal and mechanical properties were analyzed in detail. The experimental results show that the composites possess a compact microstructure because HIPS increases the fluidity of PPO. Due to the excellent dielectric properties of both mPPO and MTCLT, the composites have an extremely low dielectric loss. The realization of the high ceramic filler fraction greatly limits the thermal expansion of the polymer chain by introducing the interphase, so that the coefficient of thermal expansion of the composite material could be as low as 21.8 ppm/C. At the same time, the presence of ceramic particles could reinforce the mechanical property of the composites. When the ceramic filler fraction is higher than 20 vol.%, the bending strength of the composite material is around 110 MPa. When the ceramic filler fraction is 40 vol.%, the composite possesses the best comprehensive performance. The dielectric constant is 6.81, the dielectric loss is 0.00104, the thermal expansion coefficient is as low as 25.3 ppm/C, and the bending strength is 110.4 MPa. Due to its excellent properties, this material can be a good candidate in the field of microwave communication.A novel category of polyphenylene oxide/high-impact polystyrene (PPO/HIPS) alloy was used as the polymer matrix (abbreviated as mPPO) and loaded with different volume fractions (0, 10, 20, 30, 40, 50 vol.%) of MgTiO3–Ca0.7La0.2TiO3 (abbreviated as MTCLT) ceramics to prepare composites by injection molding. Its micromorphology, density, dielectric, thermal and mechanical properties were analyzed in detail. The experimental results show that the composites possess a compact microstructure because HIPS increases the fluidity of PPO. Due to the excellent dielectric properties of both mPPO and MTCLT, the composites have an extremely low dielectric loss. The realization of the high ceramic filler fraction greatly limits the thermal expansion of the polymer chain by introducing the interphase, so that the coefficient of thermal expansion of the composite material could be as low as 21.8 ppm/C. At the same time, the presence of ceramic particles could reinforce the mechanical property of the composites. When the ceramic filler fraction is higher than 20 vol.%, the bending strength of the composite material is around 110 MPa. When the ceramic filler fraction is 40 vol.%, the composite possesses the best comprehensive performance. The dielectric constant is 6.81, the dielectric loss is 0.00104, the thermal expansion coefficient is as low as 25.3 ppm/C, and the bending strength is 110.4 MPa. Due to its excellent properties, this material can be a good candidate in the field of microwave communication.

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    Yahan Liu, Haiyi Peng, Xiaogang Yao, Minmin Mao, Kaixin Song, Huixing Lin. Study on properties of ultra-low dielectric loss mPPO/MTCLT composites prepared by injection molding[J]. Journal of Advanced Dielectrics, 2022, 12(3): 2250004

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    Paper Information

    Category: Research Articles

    Received: Mar. 15, 2022

    Accepted: Apr. 20, 2022

    Published Online: Nov. 1, 2022

    The Author Email: Yahan Liu (1423243383@qq.com)

    DOI:10.1142/S2010135X22500047

    CSTR:32405.14.S2010135X22500047

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