Optical Technique, Volume. 47, Issue 5, 556(2021)

Gradient packaging adhesive structure design to improve the light color performance of white LED modules

SHENG Lijun*
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  • [in Chinese]
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    By using the thermal solution methodthe surface of the inverted chip was coated with a remote layer and a fluorescent adhesive film layer doped with nanoparticles of a certain concentrationand the gradient double-layer structure white light LED module samples were prepared.The photochromic properties of the samples were tested and the mechanism was analyzed. The results showed that adding remote layer between the chip and fluorescent adhesive film increased the light quantum number at the center normal line by 32.35% compared with the uncoated remote layerthe slope of the fitting line tends to be horizontaland the uniformity of photon spatial distribution is improved obviously. With the increase of SiO2 doping concentrationthe color temperature distribution curve gradually becomes flat. The average color temperature decreases from 6199.66k when the doping concentration is 0% to 5103.24ka decrease of 21.48%. The measured value of light flux first increased and then decreased with the increase of SiO2 doping concentration. When the doping concentration was 0.6%the maximum value reached 181mlmwhich increased by 9.70% compared with the undoped SiO2 particles. The efficiency of photon extraction is improved by means of gradient decreasing refractive index between the interfaces of double-layer white light LED moduleand the consistency of space color is improved obviouslyproviding a reference for improving the quality of white light LED module.

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    SHENG Lijun. Gradient packaging adhesive structure design to improve the light color performance of white LED modules[J]. Optical Technique, 2021, 47(5): 556

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    Paper Information

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    Received: Feb. 7, 2021

    Accepted: --

    Published Online: Nov. 6, 2021

    The Author Email: Lijun SHENG (shenglijun@sxvtc.com)

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