As a core technology in optoelectronics, optoelectronic integration technology is currently undergoing rapid development, progressing from discrete devices towards highly integrated and multifunctional solutions. Key technologies encompass heterogeneous integration of diverse materials on the same substrate, heterostructured integration of different device architectures, and the packaging of integrated systems. Building upon the fundamental concepts and development overview of optoelectronic integration technology, its key development characteristics are analyzed systematically. Analysis reveals that the technology exhibits a pronounced trend towards multimaterial fusion, continuous enhancement of integration levels, and continuous expansion of application fields, evident in aspects such as materials, device design and fabrication processes. Finally, addressing the current technological bottlenecks and research status within the field, the future development directions and potential breakthroughs for optoelectronic integration technology are presented.