To improve the heat dissipation efficiency and to enhance the lifetime and wavelength stability for diode lasers, a roof-like silicon microchannel heat sink characterized by a high integration level is developed. Taguchi robust design method is applied to the design of microchannel heat sinks and orthogonal experiments and signal-noise ratio calculation are carried out to optimize the key parameters. A microchannel heat sink prototype with a channel width around 50 μm and a roughness better than 0.1 μm is fabricated on a (110) silicon substrate by using a KOH anisotropic etching and an anodic bonding,and laser diode bars are welded on it to test its thermal resistance. The active region temperature rise of the middle bar is estimated by using the temperature coefficient of GaAs laser wavelength,and the thermal resistance is calculated. Experimental results show that the thermal resistance per unit area is 0.070 cm2·K/W,which agrees with that calculated by the finite element method.