Journal of Optoelectronics · Laser, Volume. 33, Issue 10, 1031(2022)

A multichannel demultiplexed optical-to-electrical conversion module based on microwave photonic hybrid-packaging technology

XU Weihua1,2, LV Xiaomeng1,2、*, LIAO Ao1,2, WU Yilong1, ZHANG Tongtong1,2, and LI Xibin1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    Based on microwave photonic hybrid-packaging technology,a multichannel demultiplexed optical-to-electrical (O/E) conversion module is fabricated.Optical chip,microwave chip,free-space lens,and microwave circuit are packaged in a cavity,making the module combine the function of demultiplexing,O/E conversion and microwave processing to achieve the conversion from 1-channel multiplexed radio- over-fiber signal to 6-channel radio frequency (RF) signal and to output the signal after amplifying.The multichannel demultiplexed O/E conversion module is composed of several bare chips such as demultiplexer,focusing lens,photodetector (PD),microwave amplifier,equalizer,and power supply,which utilizing hybrid integrated packaging technology to greatly reduce the size of the module and improve integration and complexity of the module.The module shows huge potential in application of multi-functional microwave photonic area.The test results show that the module can realize the broadband conversion between radio-over-fiber signal to RF signal,and the efficiency of the O/E conversion exceeds 0.7 A/W.In addition,the test results of the amplitude-frequency characteristics show that the mean value of S21 is -8.4 dB,with a fluctuation of ±3.5 dB.The test results also show that the reflection of standing wave is less than 2 dB,and the isolation degree between adjacent channels is above 40 dBc.

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    XU Weihua, LV Xiaomeng, LIAO Ao, WU Yilong, ZHANG Tongtong, LI Xibin. A multichannel demultiplexed optical-to-electrical conversion module based on microwave photonic hybrid-packaging technology[J]. Journal of Optoelectronics · Laser, 2022, 33(10): 1031

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    Paper Information

    Received: Jan. 23, 2022

    Accepted: --

    Published Online: Oct. 9, 2024

    The Author Email: LV Xiaomeng (342721062@qq.com)

    DOI:10.16136/j.joel.2022.10.0056

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