Piezoelectrics & Acoustooptics, Volume. 46, Issue 6, 860(2024)
A Two-Dimensional Dual-Path Orthogonal Surface Acoustic Wave Vector Magnetic Field Sensor
Surface acoustic wave (SAW) vector magnetic field sensors demonstrate considerable potential for a range of applications, given their ability to respond with high directionality to the direction of the magnetic field in space. However, single-pass sensors are afflicted with issues such as response randomness and low reliability, which restrict their deployment in precise magnetic field measurements. In response to the need for high-sensitivity SAW magnetic field sensors for the detection of space vector magnetic fields, this study proposes a highly sensitive SAW vector magnetic field sensor and a two-dimensional dual-path orthogonal structure. The sensor employs a planar semiconductor process to deposit a metallic aluminum transducer on an ST-90°X quartz substrate, thereby forming a delay line structure. Additionally, an anisotropic CoFeB magneto-sensitive thin film is incorporated into the acoustic propagation path through magnetron sputtering. The experimental results demonstrate that the designed 200 MHz SAW magnetic field sensor exhibits a phase response sensitivity of 55.214(°)/Oe when the SAW propagation direction is perpendicular to the applied magnetic field. Furthermore, the directional phase response exhibits a notable difference under different directional magnetic fields, and the sensor demonstrates good repeatability and stability. The two-dimensional dual-path orthogonal structure preserves the high sensitivity characteristics of the single-path element, offering a novel approach to achieve high-precision two-dimensional all-plane magnetic field detection.
Get Citation
Copy Citation Text
WU Yutong, JIA Yana, WANG Wen. A Two-Dimensional Dual-Path Orthogonal Surface Acoustic Wave Vector Magnetic Field Sensor[J]. Piezoelectrics & Acoustooptics, 2024, 46(6): 860
Category:
Received: Nov. 5, 2024
Accepted: Feb. 13, 2025
Published Online: Feb. 13, 2025
The Author Email: