Semiconductor Optoelectronics, Volume. 46, Issue 3, 498(2025)
Numerical Simulation of Enhanced Heat Transfer in a Double-Layer Microchannel Based on Field Synergy and Entransy Dissipation
The flow and heat transfer processes in a wavy double-layer microchannel heat sink were numerically simulated using CFD techniques. The effects of Reynolds number and the upper-layer truncation length ratio on flow and heat transfer performance were analyzed. Based on the field synergy principle and entransy dissipation theory, the flow and heat transfer characteristics of four types of double-layer microchannel heat sinks were comparatively analyzed, revealing the internal mechanisms responsible for enhanced heat transfer. The simulation results show that under laminar flow conditions, the average temperature of the microchannel heat sink gradually decreases as the Reynolds number increases. In contrast, the Nusselt number, surface heat transfer coefficient, and the integrated performance evaluation criterion increase with Reynolds number, while entransy dissipation decreases. At the same Reynolds number, the synergistic angle of heat transfer is smallest when the upper channel length ratio of the wavy-bottom structure is 0.2. Among the configurations studied, the wavy-bottom double-layer microchannel heat sink with an upper channel length ratio of 0.2 exhibits the best overall performance in terms of heat transfer efficiency and flow characteristics.
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HU Mingzhe, YUN Heming, WANG Baoxue, LIU Wenzhu. Numerical Simulation of Enhanced Heat Transfer in a Double-Layer Microchannel Based on Field Synergy and Entransy Dissipation[J]. Semiconductor Optoelectronics, 2025, 46(3): 498
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Received: Apr. 27, 2025
Accepted: Sep. 18, 2025
Published Online: Sep. 18, 2025
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