During adhesive microbonding， both the adhesive thickness and the filling status can significantly affect the bond strength and creeping. In this study， the film-forming process by extrusion using a high-viscosity adhesive was examined. A typical group of tiny round parts is selected for adhesive microbonding. The simulation model describing the adhesive microbonding and the ratio of space occupancy by the adhesive， which represents the filling status， was established. The process parameters were initially determined based on the evaluated results， such as the amount of adhesive droplets. A precision adhesive microbonding assembly device was developed， and an epoxy resin adhesive was selected as the sample for adhesive microbonding experiments and analysis. Under suitable experimental conditions， the ratio of space occupancy by the adhesive increased with increasing amount of adhesive droplets， but tended to stabilize at 91.8%. In addition， adhesive thickness had an approximately linear relationship with extrusion force， and this relationship was less affected by the amount of adhesive droplets. An adhesive thickness of 25 μm was achieved as the extrusion force reached 7.92 N. The results of this study will help improve the existing adhesive microbonding process.