High Power Laser and Particle Beams, Volume. 37, Issue 6, 065003(2025)
Bubble-free and precise temperature control system of insulating coolant for photoconductive switch with repetition frequency
When the photoconductive switch operates continuously under the working conditions of long pulse width and high repetition frequency, due to the existence of a certain conduction resistance, the thermal deposition phenomenon inside the switch is relatively serious, which is likely to cause thermal damage and thermal breakdown of the photoconductive switch, seriously affecting its service life. Therefore, it is necessary to effectively dissipate heat from the high-power photoconductive switch. The conventional cooling circulation system uses the method of pumping out by a circulation pump to cool the object. There are problems such as very high or low pressure of the cooling medium during the circulation process, resulting in uneven cooling of the object, which is extremely likely to cause damage to the object. In addition, the impeller of the circulation pump will generate bubbles during the circulation process, reducing the insulation strength of the photoconductive switch and leading to flashover breakdown along the surface. To address these issues, we have developed a cooling system that eliminates bubbles based on the negative pressure suction mechanism and achieves precise temperature control through a dual-loop system. This system has achieved good heat dissipation for the photoconductive switch. Under the conditions of a working voltage of 11 kV, an output current of 560 A, a pulse width of 55 ns, and a repetition frequency of 1 kHz, the service life of the photoconductive switch has reached 106 times, which is significantly increased.
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Jinshui Xiao, Yupeng Huang, Chongbiao Luan, Hongtao Li, Jianqiang Yuan, Xun Ma. Bubble-free and precise temperature control system of insulating coolant for photoconductive switch with repetition frequency[J]. High Power Laser and Particle Beams, 2025, 37(6): 065003
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Received: Jun. 3, 2024
Accepted: Mar. 19, 2025
Published Online: Jun. 23, 2025
The Author Email: Yupeng Huang (huang150408@qq.com)