High Power Laser and Particle Beams, Volume. 35, Issue 3, 034001(2023)

Design and thermal structure analysis of a dump beam window for high repetition frequency

Hao Zhang1, Liming Huang1, Feng Zhao2, Hanwen Lin1, Renchao Chang1, Jianping Wei1, Dejun E1, Wei Wei1、*, Kai Tao1, Jiayue Yang1, and Weiqing Zhang1
Author Affiliations
  • 1Institute of Advanced Science Facilities, Shenzhen 518107, China
  • 2Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian 116023, China
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    Shenzhen Superconducting Soft X-ray Free Electron Laser (S3FEL) will be the only high refrequency free electron laser in soft X-ray band in the world. Dump, playing an important role in system beam tuning, is an important equipment of S3FEL device. As an important component of dump, dump beam window is used to isolate and protect the ultra-high vacuum environment of the accelerator. In this paper, several commonly used materials for dump beam window are compared and analyzed, beryllium is finally chosen as the material. A dump beam window with water-cooled structure is designed using to beryllium. The deposition power of beam window with different thickness is calculated by Monte Carlo method. The thermal-mechanical simulations based on the finite element analysis method show that the water-cooled beryllium window with a thickness of 1.6 mm is the best and meet the application requirements. Its maximum temperature is 121.6 ℃. The maximum stress and central deformation at low vacuum of 1 Pa are 198.7 MPa and 0.000 82 mm respectively. The maximum stress and central deformation at low vacuum of 101 325 Pa are 204.2 MPa and 0.097 mm respectively. The present study provides a critical theoretical basis for the design of dump beam window in S3FEL.

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    Hao Zhang, Liming Huang, Feng Zhao, Hanwen Lin, Renchao Chang, Jianping Wei, Dejun E, Wei Wei, Kai Tao, Jiayue Yang, Weiqing Zhang. Design and thermal structure analysis of a dump beam window for high repetition frequency[J]. High Power Laser and Particle Beams, 2023, 35(3): 034001

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    Paper Information

    Category: Particle Beams and Accelerator Technology

    Received: Oct. 20, 2022

    Accepted: --

    Published Online: Mar. 9, 2023

    The Author Email: Wei Wei (weiwei@mail.iasf.ac.cn)

    DOI:10.11884/HPLPB202335.220350

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