Journal of Advanced Dielectrics, Volume. 11, Issue 2, 2150009(2021)

Dielectric properties of amorphous Bi–Ti–O thin films

R. Sun1, W. Xu2, and R. B. van Dover1、*
Author Affiliations
  • 1Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA
  • 2Department of Applied and Engineering Physics, Cornell University, Ithaca, NY 14853, USA
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    We report the unexpectedly excellent dielectric properties of amorphous thin films with compositions in the Bi–Ti–O system. Films were deposited by RF magnetron reactive co-sputtering. In the composition range of 0.5 < x < 0.7, amorphous Bi1xTixOy exhibits excellent dielectric properties, with a high dielectric constant, 𝜀r 53, and a dissipation factor as low as tan δ = 0.007. The corresponding maximum breakdown field reaches 1.6 MV/cm, yielding a maximum stored charge per unit area of up to 8 μC/cm2. This work demonstrates the potential of amorphous Bi–Ti–O as a high-performance thin-film dielectric material that is compatible with high-performance integrated circuits.We report the unexpectedly excellent dielectric properties of amorphous thin films with compositions in the Bi–Ti–O system. Films were deposited by RF magnetron reactive co-sputtering. In the composition range of 0.5 < x < 0.7, amorphous Bi1xTixOy exhibits excellent dielectric properties, with a high dielectric constant, 𝜀r 53, and a dissipation factor as low as tan δ = 0.007. The corresponding maximum breakdown field reaches 1.6 MV/cm, yielding a maximum stored charge per unit area of up to 8 μC/cm2. This work demonstrates the potential of amorphous Bi–Ti–O as a high-performance thin-film dielectric material that is compatible with high-performance integrated circuits.

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    R. Sun, W. Xu, R. B. van Dover. Dielectric properties of amorphous Bi–Ti–O thin films[J]. Journal of Advanced Dielectrics, 2021, 11(2): 2150009

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    Paper Information

    Category: Research Articles

    Received: Jan. 8, 2021

    Accepted: Mar. 16, 2021

    Published Online: Nov. 1, 2022

    The Author Email: van Dover R. B. (vandover@cornell.edu)

    DOI:10.1142/S2010135X21500090

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