Laser & Optoelectronics Progress, Volume. 62, Issue 5, 0512005(2025)

Design and Application of Dual-Band Specific Color Temperature Measuring Device

Haiying Shao1、*, Zengliang Zhang2, Xiaohan Ma1, Yanfeng Li1, Yuhang Fu1, and Jiabin Ma1
Author Affiliations
  • 1School of Electronic and Control Engineering, North China Institute of Aerospace Engineering, Langfang 065000, Hebei , China
  • 2School of Electronic and Information Engineering, Langfang Normal University, Langfang 065000, Hebei , China
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    In dynamic temperature testing, the colorimetric temperature measurement method effectively reduces emissivity-related influences due to its unique temperature measurement principle, offering advantages such as fast response, wide temperature range, and non-intrusiveness. This study leverages colorimetric temperature measurement to design a dynamic temperature testing device. A comprehensive discussion is provided on the colorimetric temperature measurement principle, device configuration, dual-wavelength selection criteria, and photodetector circuit design. The device underwent static calibration using a high-temperature blackbody furnace, yielding a fitting equation between output voltage and corresponding temperature. To assess measurement accuracy, a hydrogen-oxygen water welding machine heated a stainless steel target to simulate a temperature field, and dynamic temperature measurements were simultaneously conducted using the calibrated device and a standard infrared thermometer. Experimental results indicate that the relative error of the colorimetric temperature measurement device remains below 5.4% within the 400?1200 ℃ range, demonstrating accurate dynamic temperature testing capabilities in this range.

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    Haiying Shao, Zengliang Zhang, Xiaohan Ma, Yanfeng Li, Yuhang Fu, Jiabin Ma. Design and Application of Dual-Band Specific Color Temperature Measuring Device[J]. Laser & Optoelectronics Progress, 2025, 62(5): 0512005

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: Jul. 15, 2024

    Accepted: Aug. 20, 2024

    Published Online: Mar. 12, 2025

    The Author Email:

    DOI:10.3788/LOP241681

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