This study proposes a dry ice particle spray cooling radiator for addressing the thermal management issues in high power semiconductor laser. The thermal flow field of the radiator is simulated using FLUENT software. The results indicate that the heat dissipation effect is optimal when the radiator has multi-outlet nozzles in the inlet and the cold fluid undergoes disturbances caused by the needle. With a dry ice flow velocity of 0.5 m/s, the stabilized temperature is measured to be 24.79 ℃. A comparison between experimental testing and simulation result reveals a maximum relative error of 8.3% and 8.8%, respectively. Moreover, in comparison to microchannel water cooling, dry ice cooling exhibits lower overall temperature of laser, higher electro-optical conversion efficiency, uniform temperature distribution along the width of the vertical bars, and reduced thermal stress-induced "smile" effects. These findings lay the foundation for the development of high power horizontal array semiconductor lasers with dry ice cooling.