In order to meet the demand of micro film apparatus in micro electronic industry, a series of experiments were carried out on the ultraviolet laser cutting thin metal film, and the effects of laser cutting parameters on the kerf width and quality were studied. Aiming at the high flexible coefficient and easy deformed etc. characteristics of thin metal film, a special clamp and cutting equipment was introduced. The results showed that during the process of the high power ultraviolet laser precise cutting, according to the kind and thickness of thin metal film, suitable ultraviolet laser power and cutting speed are selected to decrease the kerf width and good kerf quality is obtained; besides, suitable fixing method for the thin metal film is selected to ensure the thin film no distortion and improve the cutting precision and the success probability of the micro film apparatus machining effectively.