In order to study the influence of process parameters by multi-mode semiconductor laser additive manufacturing on the residual stress field of the cladding layer, ANSYS software was used to build a single-track cladding layer model. The multi-mode semiconductor laser heat source was loaded by using the life-and-death element method. Orthogonal experiment was used to study the influence of process parameters on the stress field distribution in the width and height of the cladding layer. The results show that the stress field along the width of the clad layer is symmetrical on both sides and has obvious platform effect at the center, which reflects the heat of multi-mode laser is average; In the height direction of the cladding layer, the stress increases gradually along the height until the surface of the cladding layer reaches the maximum value; The effect order of process parameters on residual stress is: powder feeding rate> scanning speed> laser power; The maximum stress on the width and height direction of the clad layer is 196.53 MPa and 98.22 MPa when the optimal process parameters are adopted, which greatly reduces the value of residual stress and provides a reference for controlling residual stress in cladding layer by multi-mode semi-conductor laser additive manufacturing.