At present, machine vision is often used in large-scale repetitive industrial production process and some occasions where artificial vision is difficult to meet the requirements, through the machine vision detection method can greatly improve the production efficiency and automation. For some objects that need multi-faceted high-accuracy detection, such as semiconductor thermoelectric cooler (TEC) components, it is often necessary to configure an image acquisition device for each facet and use multiple sets of mechanisms to realize multi-facet detection, which increases the complexity of installation and reduces the reliability of the device. Simultaneous equal optical path confocal imaging of semiconductor TEC components’ two adjacent surfaces based on two-color separation imaging method is proposed, so as to reduce the number of image acquisition devices and the complexity of the device. The device can realize the same optical path confocal imaging of two adjacent surfaces of the TEC component simultaneously, and can be found applications in the automatic inspection fields of machine vision which needs multi-facet inspection, so as to reduce the cost in the actual manufacturing process.