To accurately measure the residual stress distribution, a reflective dark-field white light digital holography-based three-dimensional (3D) residual stress detection technology is proposed herein. This technology discretizes the area near the laser damage point into multiple layers in a numerical manner along the axis. The intensity of the dark-field reflected light of each layer is proportional to the axial gradient of the optical birefringence of the layer. Therefore, white-light digital holography is used to measure each layer. By measuring the reflected light intensity of each layer dark field with white light digital holography, the shear stress of each layer can be reconstructed by combining the photoelastic effect. Through the measurement of laser-damaged fused silica glass, it is verified that the proposed technique can accurately reconstruct the three-dimensional residual stress distribution of the sample, and the axial resolution can reach 10 μm. Experimental results show that the proposed technology can improve processing technology and also measure the quality of products.