Journal of Advanced Dielectrics, Volume. 15, Issue 3, 2450028(2025)

Co2+-enhanced zinc aluminate microwave dielectric ceramics for electronic packaging to thermally match printed circuit boards

Liyuan Huang1, Yuanxun Li1,2、*, Yanfeng Shang1, Chuming Li1, Xinyan Liu1, Longyuan Zhao1, and Fuyu Li1,2、**
Author Affiliations
  • 1School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China
  • 2State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China
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    With the rapid development of electronic integration technology, highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards. Here, Zn1?xCoxAl2O4 (ZCAO, x= 0.00–0.20) ceramics are synthesized using the solid-state reaction method. The phase composition, microstructure, microwave dielectric properties and CTE of Zn2+ in the ZnAl2O4 ceramic substituted by Co2+ are systematically revealed. An appropriate amount of Co2+ substitution promotes a more homogeneous grain growth to form a dense microstructure. The average grain size, bulk density and relative density of ZCAO (x=0.10) ceramic are 1.59μm, 4.472g/cm3 and 97.4%, respectively. The optimal microwave dielectric properties (εr=8.2, Q×f=100,701GHz, τf=?66ppm/°C) of the ZCAO (x=0.10) ceramic sintered at 1450°C are achieved. More importantly, the ZCAO (x = 0.10) possesses a CTE = 11.59ppm/°C that is nearly thermally matched to the printed circuit boards (PCB, CTEPCB = 12ppm/°C). This ceramic has great potential for application in the electronic packaging of PCB devices.

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    Liyuan Huang, Yuanxun Li, Yanfeng Shang, Chuming Li, Xinyan Liu, Longyuan Zhao, Fuyu Li. Co2+-enhanced zinc aluminate microwave dielectric ceramics for electronic packaging to thermally match printed circuit boards[J]. Journal of Advanced Dielectrics, 2025, 15(3): 2450028

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    Paper Information

    Category: Research Articles

    Received: Sep. 13, 2024

    Accepted: Nov. 7, 2024

    Published Online: Jul. 7, 2025

    The Author Email: Yuanxun Li (liyuanxun@uestc.edu.cn), Fuyu Li (f_y_lee@163.com)

    DOI:10.1142/S2010135X24500280

    CSTR:32405.14.S2010135X24500280

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