Journal of Advanced Dielectrics, Volume. 15, Issue 3, 2450028(2025)
-enhanced zinc aluminate microwave dielectric ceramics for electronic packaging to thermally match printed circuit boards
Liyuan Huang1, Yuanxun Li1,2、*, Yanfeng Shang1, Chuming Li1, Xinyan Liu1, Longyuan Zhao1, and Fuyu Li1,2、**
Author Affiliations
1School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China2State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, P. R. Chinashow less
With the rapid development of electronic integration technology, highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards. Here, CoxAl2O4 (ZCAO, x= 0.00–0.20) ceramics are synthesized using the solid-state reaction method. The phase composition, microstructure, microwave dielectric properties and CTE of in the ZnAl2O4 ceramic substituted by are systematically revealed. An appropriate amount of substitution promotes a more homogeneous grain growth to form a dense microstructure. The average grain size, bulk density and relative density of ZCAO () ceramic are 1.59m, 4.472g/cm3 and 97.4%, respectively. The optimal microwave dielectric properties (, ,701GHz, ppm/°C) of the ZCAO () ceramic sintered at 1450°C are achieved. More importantly, the ZCAO (x = 0.10) possesses a CTE = 11.59ppm/°C that is nearly thermally matched to the printed circuit boards (PCB, CTEPCB = 12ppm/°C). This ceramic has great potential for application in the electronic packaging of PCB devices.