CMOS-SEED integrated chip with input/output optical windows combine the advantages of electrical logic processing and optical interconnection. The layout of CMOS integrated circuit is designed. The chip is fabricated with 0.35 μm processing technique in HP Company and flip-chip bonded SEED device is performed by Bell Lab.. The CMOS-SEED integrated chip with input/output optical windows is developed successfully. A 16×16 free-space crossbar photonic switching module with CMOS-SEED integrated chip is designed and fabricated. The functions of 16×16 crossbar photonic switching are implemented.